GL-12 830 Points Solderless Breadboard

• Electronics prototyping: Building and testing circuits for various applications.
• Education: Teaching electronics and circuit design.
• Hobbyists and makers: Creating projects and experiments.
• Research and development: Developing and testing new electronic devices.

• 830 contact points: Offers ample space for connecting components.
• Solderless design: Allows for quick and easy component insertion and removal.
• Power and ground bus strips: Provides convenient connections for power supply and ground.
• Modular design: Can be connected with other breadboards for larger projects.
• Durable construction: Built to withstand repeated use.

DATA SHEET AND USECASE

Key Specification:

• Total Tie Points: 830, arranged to accommodate complex circuit configurations.
• Material: Constructed from high-quality ABS plastic for durability.
• Compatibility: Supports standard DIP ICs and components with a 2.54 mm pin spacing.
• Power Rails: Equipped with dual power rails for convenient power distribution across the board.
• Adhesive Backing: Features a self-adhesive tape on the back for secure mounting on various surfaces.
• Interconnectivity: Designed with projections allowing multiple breadboards to be connected for expanded projects.